How to Solving Solder Remelting and Bridging in Multiple Reflow
In today’s complex electronics manufacturing environment, multiple reflow cycles are increasingly common—especially in double-sided PCB assembly and modules with mixed-technology components. However, this introduces serious challenges: solder remelting, solder bridging, and component misalignment during secondary or tertiary reflows. One of the most effective solutions is the use of high-temperature Pb-free solder pastes. The Challenge: Remelting…